Daniel Evans

Daniel Evans began his career at Hughes Aircraft (now Palomar Technologies) as a Design Engineer in 1984 and later, in several different key positions in R&D and Engineering. Mr. Evans developed many of the core technologies fundamental to Palomar Technologies’ automated equipment platforms; presently these platforms are installed in thousands of machines around the world. Through this work, Mr. Evans received eight motion control and system patents. Additionally, he has published over 20 technical papers including the widely popular “AuSi and AuSn Eutectic Die Attach Case Studies.”

Throughout Mr. Evans' career at Palomar Technologies , he has worked in the positions of Project Manager, Engineering Manager, VP of Engineering and Applications Manager. In these positions he oversaw the development and design of the market-share-leading high-precision pick and place 3500 Die Bonder (Kiver Award Winner), the CBT 6000 Wire Bonder (Semiconductor International Award Winner). In more recent years, Mr. Evans has been a key driving force for creating a broader scope of total customer advanced packaging solutions including device, application and service capability. Today, Mr. Evans holds overlapping positions as Sr. Scientist and Manager of Applications Engineering where he works one-on-one with customers to provide interconnect solutions for electro and optical products.

Mr. Evans earned a B.S. Degree in Mechanical Engineering from Purdue University, a M.S. Degree in Mechanical Engineering from Stanford University (both degrees have an emphasis in Robotics and Controls), and a Certificate from the Executive Program for Scientists & Engineers at UCSD. He serves on the Advanced Packaging Roadmap Committees for iNEMI, IMAPS, and ITRS.

Mr. Evans lives in Oceanside, CA, with his wife Kathie and has two sons.