Donald Beck

Donald Beck has led the Assembly Services division at Palomar Technologies for the last five years, expanding it from a "tiger team" to a major player in precision microelectronics contract assembly. Under Mr. Beck's tenure, Assembly Services has grown 300% and continues to develop new processes and solutions for customers worldwide.

A three-decade microelectronics industry veteran, Mr. Beck began his career at Seemed Microelectronics in San Diego and later at Vitarel Microelectronics. At Vitarel, he developed high reliability, Class B military, prototype thick film memory modules. As the needs of the business grew, Mr. Beck managed the prototype design laboratory and established an automated chip on board line capable of assembling custom MCM hybrids. In 1989, Alcoa recruited Mr. Beck to qualify and manage all assembly activity for on-shore and off-shore subcontract suppliers. There, he developed assembly techniques for Cofire Ceramic and Thin Film MCMs. In 1992, Mr. Beck moved his family from San Diego to Florida to become Lead Engineer of Advanced Manufacturing for Harris Corporation. At Harris, he not only engineered complex military packages, but also managed a large microelectronic assembly supply chain. Highlights of achievements at Harris include: developing EK ADSP MCM and Cobra Link RFM fabrication; assembly definition for flat panel radiation, signal processing displays and large multi-chip module assemblies; high frequency ribbon/wire bonding and chip-on-board process development; evaluate alternative solder joints for large MCM packages and study the interconnect attachments of RF/Microwave Devices. In 1999, Mr. Beck received the "Defense Manufacturing Excellence Award." Palomar Technologies recruited Mr. Beck in 2004 to run the Applications Division, holding the title of Sr. Applications Engineer. Here, he developed ball bump applications, automated interconnect processes including an automated part pass through system (for automotive customers), and an ultra-fine pitch (60um-70um) interconnection processes for complex MCM applications. Through his tenure, he was tapped to take on the additional title and responsibilities of managing Palomar Technologies' Applications, seeing through all new processes and equipment buy-offs. A year later, he was named General Manager of Assembly Services at Palomar Technologies.

Mr. Beck has published several technical papers and articles including "The Great Debate: Ball vs. Wedge" and "LED Matrix High Brightness Assembly". He holds five patents: Closely Coupled Capacitor on Die (COD) for Microelectronic Circuits; Lightweight Modular Antenna Assembly having RF Amplifier Modules Embedded in Support Structure Between Radiation and Signal Strength Distribution Panels; High Frequency, Low Temperature, Thermosonic Ribbon Bonding Process for System Level Applications; Method for Removing Microelectronic Substrates 1; Method for Removing Microelectronic Substrates 2.

Mr. Beck is an avid surfer and a father of six. He currently lives in San Marcos, CA with his wife.