Palomar currently has a career opportunity for a Wire Bond Engineer for its Assembly Services. Successful candidate will a background in wire bonding, specifically automated ball bonding.
Palomar Technologies, Inc. is a leading supplier of solutions for microelectronic and optoelectronic packaging, and experts in the design and operation of precision wire bonding and high accuracy component placement systems. Palomar's award-winning automated high-precision assembly systems enable customers to increase yield and reduce costs in the manufacturing of LED, optoelectronic, solar, RF, and microelectronic packages in the photonic, wireless, microwave, automotive, aerospace, defense, medical, and life sciences industries. Palomar’s experience with design, engineering, prototyping, assembly, automation, and metrology takes its customers from concept up to and into production. Customers consistently demonstrate the viability of their new products by developing prototypes with Palomar’s systems and processes needed for high volume manufacturing.
Duties & Responsibilities:
- Develop new automated wire bond programs and optimize process parameters
- Support wire bond processes for customer deliverable materials
- Document wire bond process details in specification(s) and work instructions
- Define applicable wire bond materials for specific applications (wire type, capillary part numbers, etc.)
- Define statistical monitoring methods supporting developed wire bond processes
- Support automated die attach processes as needed to maintain product flow (i.e. run existing process recipes)
Personal Attributes:
- Project a professional face to the Customer in all circumstances, including demonstrations, communications, reports, etc.
- Goal oriented self starter with a sense of urgency
- Work well alone and in a team environment
- Good people skills; especially with customers
- Good lab notebook skills for recording experimental results and documenting for learning and reproduction
- Good written and verbal communication skills
- Good system level trouble shooting skills for semiconductor packaging processes and the ability to separate out between man, machine, or material issues
- Desire thoroughness, accuracy, and efficiency
- Proficiency in MS Word and MS Excel
Experience Desired:
- Process background in microelectronic packaging, specifically in wire bonding
- Knowledge of die attach processes would be beneficial but not essential
- Technical customer interface
- Technical writing background
- Production support in a clean-room environment
- Work-related travel
- Computer skills (i.e. Word, Excel)
Knowledge Desired:
- Knowledge of wire and die bonding equipment
- Upstream and downstream processes
- Process development
- SPC
- DOE
- Clean room set-up and controls
- Specific knowledge of Mil-Std 883 is preferred
Education:
- BS or MS in engineering preferred
- 1-5 yrs technical experience working in an engineering role
Special Requirements:
10-20% US and Int’l travel. Passport and current driver’s license required. Must possess a credit card or have the ability to obtain a credit card for travel purposes.
Palomar Technologies offers an attractive salary and benefits package including 401(k) with employer matching, medical, dental, vision, and education reimbursement. Palomar Technologies is an Equal Opportunity Employer. We seek qualified applicants without regard to race, color, religion, sex, sexual orientation or national origin. Proof of eligibility to work in the United States is required.
