Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.
Palomar® Technologies provides packaging solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, Palomar now supports a wide range of industries including automotive, lasers, LEDs, medical & bio photonics, military/high reliability/MEMS, power semiconductors, RF/microwave/wireless, sensors and telecom/5G/Datacom. Select your industry to learn about Palomar’s solutions.
Palomar® Technologies offers multiple locations with full-service OSAT laboratories which provide volume manufacturing, process development, package prototyping, assembly, test, and measurement for processes such as die attach, wire bonding, vacuum reflow, and more.
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Contact us for more info about our Total Process Solution including die bonders, wire and wedge bonders, SST vacuum reflow systems, and Innovation Centers.
Royce Instruments’ bond testing systems can handle a variety of testing applications including wire bond loop pull testing, wire bond ball shear testing, BGA ball shear and pull testing, die bond shear testing, and high speed ball shear testing.
AP+: Automated Die Sorter
AutoPlacer MP300: Automatic Die Handling, Ejector & Sorting System
DE35-ST: Semi-Automatic Die Handling System
650 Universal Bond Tester
620 Multi-test Bond Tester
610 Dedicated Wire Pull Bond Tester