About

Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.

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Applications

Palomar® Technologies provides packaging solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, Palomar now supports a wide range of industries including automotive, lasers, LEDs, medical & bio photonics, military/high reliability/MEMS, power semiconductors, RF/microwave/wireless, sensors and telecom/5G/Datacom. Select your industry to learn about Palomar’s solutions.

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Overview


Innovation Centers

Palomar® Technologies offers multiple locations with full-service OSAT laboratories which provide volume manufacturing, process development, package prototyping, assembly, test, and measurement for processes such as die attach, wire bonding, vacuum reflow, and more.

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Overview


Resources

Get access to our entire knowledge database: read blog articles and download materials.

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Contact Us

Contact us for more info about our Total Process Solution including die bonders, wire and wedge bonders, SST vacuum reflow systems, and Innovation Centers.

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Overview


GPD Global’s precision fluid dispensing systems are designed for low-volume, high-mix, R&D, and high-volume 24/7 production. Applications include MicroVolume dots and lines, Underfills, Encapsulations, Lens Fixing, and Masks.

The MAX Series dispense system is capable of a wide variety of dispense applications, including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED Encapsulation, and Masks. The MAX Series is available, depending on your production requirements, in either a standalone or inline configuration.

GPD Global logo
GPD Mini Max

The 'II' signifies heat capability in the work area, an optional nozzle, and material heat. MAX II system is available in either standalone or inline configurations.

Convection/Forced Air.

Heat is transferred to the product via an air stream from below the board. This method is preferred when the bottom side of the product has features that are difficult to compensate for with contact fixturing.

Contact.

Heat is rapidly transferred to the product through direct contact with the product. In most cases, the fixture incorporates vacuum to pull the product to the heated surface for uniform heat transfer.

GPD Data Sheets