Awards

2016

  • New Product Introduction (NPI) Award for Bonders - 3880 Die Bonder, Winner

2015

  • Ernst&Young Entrepreneur of the Year - Bruce Hueners, Finalist
  • IMAPS 2015 Fellow of the Society - Daniel Evans, Winner

2014

  • New Product Introduction (NPI) Award for Bonders - 8000i Wire Bonder, Winner

2013

  • Top Tech Exec Awards - Carl Hempel, Finalist

2012

  • San Diego North Economic Development Council (SDNEC) Exporter of the Year - Company, Winner
  • IMAPS 2012 John A. Wagnon Technical Achievement - Daniel Evans, Winner
  • Ernst&Young Entrepreneur of the Year - Bruce Hueners, Finalist
  • CS Industry Awards, Manufacturing - Company, Finalist
  • Top Tech Exec Awards - Carl Hempel, Finalist

2011

  • Global SMT Technologies Awards for Bonders - Company, Finalist
  • TechAmerica High Tech Awards - Company, Finalist
  • IMAPS 2011 Corporate Recognition Award - Company, Winner
  • Appreciated Resolution Award – “Precision Assembly for High-Volume HB LEDs
  • Best Paper of the Session – “Evaluation of Test Protocol for Eutectic Die Attach Using High Brightness LEDs”
  • Ernst&Young Entrepreneur of the Year - Bruce Hueners, Finalist
  • New Product Introduction (NPI) Award for Electronics Assembly Equipment - 3800 Die Bonder, Winner

2010

  • Global SMT Semiconductor Packaging Die Bonding Equipment - 3800 Die Bonder, Winner
  • TechAmerica High Tech Awards - Company, Finalist
  • Certificate of Special Congressional Recognition; presented by Congressman Duncan Hunter 

2006

  • Semiconductor International Editor's Choice Best Product Award - 3500 Die Bonder, Winner 

2005

  • Semiconductor International Editor's Choice Best Product Award - 8000 Wire Bonder, Winner
  • Productronica's Global Technology Award - 8000 Wire Bonder, Winner 

2004

  • UCSD Connect's Most Innovative New Product Award - 8000 Wire Bonder, Winner
  • SEMICON West's Advanced Packaging Award - 8000 Wire Bonder, Winner 

2003

  • Advanced Packaging Award for Die Placement and Attach - Precision Eutectic 6500 Die Bonder, Winner 

1999

  • Semiconductor International Editor's Choice Best Product Award - CBT Automatic Gold Wire Bonder, Winner