PTI Press Releases

Palomar Technologies’ Advanced Solutions Division in Asia Expands to New Facility to Meet Growing Demand

marcom@bonders.com (Palomar Technologies MarCom Team) — Wed, 26 Mar 2025 15:00:00 GMT

Singapore - March 26, 2025 – Palomar Technologies, a global leader in precision microelectronics packaging solutions, is pleased to announce that its Advanced Solutions Division (ASD) in Asia has officially relocated to a larger, upgraded facility to support its expanding customer base and increasing demand for advanced services throughout the region.

Unlock Precision: AIXEMTEC's Impact on Optical Manufacturing

marcom@bonders.com (Palomar Technologies MarCom Team) — Tue, 11 Mar 2025 15:00:00 GMT

Carlsbad, CA – March 11, 2025 – Palomar Technologies, a global leader in delivering total process solutions for advanced photonics and microelectronic device packaging, announced that later this year AIXEMTEC's modular high-precision machine will be available in its Advanced Solutions Division. With this equipment, Palomar will be able to address customer needs regarding prototyping, process development, and production.

AIXEMTEC's modular high-precision machine is revolutionizing optical manufacturing by delivering unmatched precision, flexibility, and efficiency. As we embrace this technology, we are excited to explore new possibilities and drive the future of optical systems forward. Whether it's enhancing existing products or developing new ones, we are committed to being at the forefront of optical manufacturing innovation.

Palomar Technologies Expands Assembly Services into the Advanced Solutions Division

marcom@bonders.com (Palomar Technologies MarCom Team) — Thu, 27 Feb 2025 16:00:00 GMT

Carlsbad, CA – February, 27th, 2025 – Palomar Technologies Inc., a global leader in precision microelectronics packaging solutions, is proud to announce the expansion of its Assembly Services group into the Advanced Solutions Division (ASD). This transformation represents a significant investment in advanced process development, enhanced service capabilities, and an increased commitment to customer success.

Palomar Invests to Meet Growing Demand for their Assembly Services Division

marcom@bonders.com (Palomar Technologies MarCom Team) — Tue, 11 Jun 2024 15:00:00 GMT

Carlsbad, CA – June 11, 2024 – Palomar Technologies, a global leader in delivering total process solutions for advanced photonics and microelectronic device packaging, announced its significant investment into the growing Assembly Services division. Increased lab space, new manufacturing equipment, additional metrology, expanded process capability, dedicated personnel, and increased engineering capacity are all goals of Palomar’s substantial funding for their contract manufacturing, process development, and prototyping services.

SST Vacuum Reflow Systems Relocating to Palomar Technologies Headquarters

marcom@bonders.com (Palomar Technologies MarCom Team) — Tue, 28 May 2024 15:00:00 GMT

Carlsbad, CA – May 28, 2024 – Palomar Technologies, a global leader in delivering total process solutions for advanced photonics and microelectronic device packaging, announces its integration of SST Vacuum reflow systems into Palomar’s headquarters in Carlsbad, California. Moving its base of operations from Downey, California to the state-of-the-art facilities in Carlsbad allows SST to improve its manufacturing capacity and operate more efficiently by merging processes and sharing learnings between the two product lines and supporting personnel.

Palomar Technologies 3880-II Die Bonder honored by 2022 Military + Aerospace Electronics Innovators Awards

marcom@bonders.com (Palomar Technologies MarCom Team) — Thu, 08 Sep 2022 15:00:00 GMT

Carlsbad, CA – September 8, 2022 – Palomar Technologies, a global leader in delivering total process solutions for advanced photonics and microelectronic device packaging, announced today that its Palomar 3880-II Die Bonder was recognized among the best by the 2022 Military + Aerospace Electronics Innovators Awards. An esteemed and experienced panel of judges from the aerospace and defense community recognized Palomar Technologies as a Gold honoree.

Palomar Technologies Appoints New Managing Director for its European Operations

marcom@bonders.com (Palomar Technologies MarCom Team) — Wed, 31 Aug 2022 08:00:00 GMT

Palomar Technologies GmbH is Headquartered in Erlangen, Germany

Palomar Technologies Places Palomar 9000 Wedge Bonder with Bay Photonics for Advanced Photonics Applications

marcom@bonders.com (Palomar Technologies MarCom Team) — Tue, 23 Aug 2022 15:00:00 GMT

Carlsbad, CA – August 23, 2022 – Palomar Technologies, a global leader in delivering total process solutions for advanced photonics and microelectronic device packaging, announced today that Bay Photonics, an advanced photonics assembly and packaging company has taken delivery of a Palomar 9000 Wedge Bonder as a requirement for meeting the demands for wedge-to-wedge bonding by their customers.

Palomar Technologies Expands Innovation Center-Singapore to Support Growing Demand for Specialty OSAT/Process Development

marcom@bonders.com (Palomar Technologies MarCom Team) — Tue, 19 Jul 2022 15:00:00 GMT

Carlsbad, CA – July 19, 2022 – Palomar Technologies, a global leader in delivering total process solutions for advanced photonics and microelectronic device packaging, announced today the expansion of its Innovation Center in Singapore to meet a growing demand in Southeast Asia for process development and specialty OSAT for advance semiconductor new product introductions.

Palomar Technologies places SST 5100 Vacuum Furnace at the EPIC-CENTRE-Torbay to Support Optoelectronics Packaging

marcom@bonders.com (Palomar Technologies MarCom Team) — Thu, 30 Jun 2022 15:00:00 GMT

Carlsbad, CA – June 30, 2022 – Palomar Technologies, a global leader in delivering total process solutions for advanced photonics and microelectronic device packaging, announced the consignment of an SST 5100 Vacuum Reflow Furnace at the Electronics and Photonics Innovation Centre (EPIC) in Paignton, UK. The focus will be on delivering higher quality optoelectronics packaging for several different applications.