Leadership

As the global leader of die attach and wire bonding solutions, optoelectronic packaging systems, vacuum reflow systems and precision assembly services, since our establishment in the 1970s, we’ve pioneered assembly robot product advancements and technological interconnect innovations, giving us a remarkable edge for our customers.

INNOVATION

Our automated high-precision wire bonders, die bonders, component placement and vacuum reflow systems have gained worldwide acclaim for their performance and innovation. Awarded numerous patents in the automatic microcircuit bonder group over many decades, it is our ethos that innovation means leadership.

GLOBAL PRESENCE

Manufacturing, R&D, Applications and Assembly Services takes place primarily at our HQ in California. The Palomar business model is designed to duplicate and scale our expertise and capability across each location in greater Asia and Europe. Anywhere in the world, Palomar customers are fully supported for the life of their equipment.
  • Designed for fully automated epoxy and eutectic die attach processes, the 3880 Die Bonder combines fine placement accuracy, fast indexing time, and excellent tool planarity and repeatability make it the most advanced die bonder platform available today. Its innovative integrated Z-Theta bidirectional 8-tool bond head make it the fastest and most reliable multiple die-type bonder on the market. 

  • The SST 5100 is a vacuum and pressure furnace that provides precise automatic control of heating and cooling ramp rates. This system allows for heating up to 500°C and cooling in an inert gas environment from vacuum levels below 50 millitorr to pressures up to 40 psig. Adding the QuikCool™ to the SST 5100 reduces cycle time and increases throughput of the package assembly process.
  • The 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder, offering the flexibility to change wire feed angles to 45-60° or 90°deep access on a single large work area. Its key differentiators - such as the large work area, high precision and no surface touch - help customers achieve modern wedge bond requirements.

  • The Palomar 8000i Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. Its patented Dual Z-Axis bond head enables extremely reliable Deep Access wire bond performance.
  • The SST 3150 is a high vacuum furnace that provides advanced packaging capabilities in vacuum levels as low as 10-7 Torr, and temperatures up to 500°C (1000°C optional). The clean-room compatible system may also be configured to allow for in situ separation of lid and package, getter firing and sealing of MEMS packages.

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