Automated Wire Bonding, Die Attach, and Contract Assembly Services
High-Accuracy Die Attach. High-Rel Wire Bonding. Automated microelectronic and optoelectronic component packaging systems.


Top 8 Resources
click to download now!

Download the 3800 Data Sheet Download the 8000 Data Sheet
Download the 6500 Data Sheet Download the 2100C Data Sheet
Hire Assembly Services Get Field Service Support
Sell Your Palomar Bonder Sign Up for Bonder Training

Featured Offers
click the arrows to see more!

PTI Blog

Tuesday, Apr 22, 2014
This second installment of the history overview of the Hughes Aircraft Industrial Products Division series will cover developments of pulsed heat technologies to bonding wire and...Read More
Tuesday, Apr 15, 2014
Wire bond interconnects have traditionally been considered "forward" bonded wires. Forward bonding refers to bonding from an integrated circuit/component down (or up) to a...Read More
Tuesday, Apr 8, 2014
[For the English version, click here .] Il y a des myriades de différences entre la soudure eutectique ou le collage à l’époxy . Il existe d’évidentes économies et...Read More