Automated Wire Bonding, Die Attach, and Contract Assembly Services
High-Accuracy Die Attach. High-Rel Wire Bonding. Automated microelectronic and optoelectronic component packaging systems.


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PTI Blog

Tuesday, Jul 22, 2014
Microelectronic programs come with many forms of risk.  If the design is manufacturable, the list is reduced, but a number of items still pose a company risk.  These...Read More
Tuesday, Jul 15, 2014
Thank you for visiting us at SEMICON West 2014 in San Francisco. It was a complete success! Over 26,000 people attended SEMICON West and Intersolar North America this year....Read More
Tuesday, Jul 8, 2014
[For the English version, click here .] Cela nous est tous arrivez un jour : Votre micro-câbleuse fonctionne parfaitement  et la production en cours attendue par...Read More