Automated Wire Bonding, Die Attach, and Contract Assembly Services
High-Accuracy Die Attach. High-Rel Wire Bonding. Automated microelectronic and optoelectronic component packaging systems.


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PTI Blog

Tuesday, Apr 15, 2014
Wire bond interconnects have traditionally been considered "forward" bonded wires. Forward bonding refers to bonding from an integrated circuit/component down (or up) to a...Read More
Tuesday, Apr 8, 2014
[For the English version, click here .] Il y a des myriades de différences entre la soudure eutectique ou le collage à l’époxy . Il existe d’évidentes économies et...Read More
Tuesday, Apr 1, 2014
Today’s multipurpose wire bonding machines are required to deliver a combination of wires, bumps, and specialty interconnects for RF, automotive, and optical markets with...Read More