Automated Wire Bonding, Die Attach, and Contract Assembly Services
High-Accuracy Die Attach. High-Rel Wire Bonding. Automated microelectronic and optoelectronic component packaging systems.

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PTI Blog

Tuesday, Jul 29, 2014
While the word “mothball” has a negative connotation in our world of capital equipment, the fact is that the very definition of mothball is machinery that is kept in working...Read More
Tuesday, Jul 22, 2014
Microelectronic programs come with many forms of risk.  If the design is manufacturable, the list is reduced, but a number of items still pose a company risk.  These...Read More
Tuesday, Jul 15, 2014
Thank you for visiting us at SEMICON West 2014 in San Francisco. It was a complete success! Over 26,000 people attended SEMICON West and Intersolar North America this year....Read More